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106250-0238 |
Molex |
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连接器
光纤连接器
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this drawing contains information that IS proprietary TO molex electronic technologies, llc and should not BE used without written permission |
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2702140 |
Phoenix Contact |
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连接器
射频互连
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please be informed that the data shown in this pdf document is generated from our online catalog. |
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2904789 |
Phoenix Contact |
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连接器
射频互连
|
please be informed that the data shown in this pdf document is generated from our online catalog. |
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485-3436 |
ETC |
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嵌入式解决方案
工程工具
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this powerful shield features the vs1053, an encoding/decoding (codec) chip that can decode a wide variety of audio formats such as mp3, aac, ogg vorbis, wma, midi, flac, wav (pcm and ADpcm). |
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DEV-13746 |
ETC |
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集成电路
接口 - 模块
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: this is the newest revision of our ftdi basic. We now use a smd 6-pin header on the bottom, which makes it smaller and more compact. functionality has remained the same. |
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SM5420E-100-A-P-S |
Silicon Microstructures, Inc. |
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传感器,变送器
压力传感器
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the sm5420e has been optimized to provide the highest possible stability for a package of this size. |
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SM5420E-030-A-P-T |
Silicon Microstructures, Inc. |
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传感器,变送器
压力传感器
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the sm5420e has been optimized to provide the highest possible stability for a package of this size. |
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SM5420E-100-A-P-T |
Silicon Microstructures, Inc. |
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传感器,变送器
压力传感器
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the sm5420e has been optimized to provide the highest possible stability for a package of this size. Performance is achieved through careful resistor placement and mechanical configuration along with advanced mems processing. |
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SM5420E-060-A-H-T |
Silicon Microstructures, Inc. |
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传感器,变送器
压力传感器
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the sm5420e has been optimized to provide the highest possible stability for a package of this size. Performance is achieved through careful resistor placement and mechanical configuration along with advanced mems processing. |
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OPT3002DNPR |
Texas Instruments |
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传感器,变送器
光学传感器
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this optical sensor greatly improves system performance over photodiodes and photoresistors |
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OPT3002EVM |
Texas Instruments |
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传感器,变送器
光学传感器
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this user’s guide describes the characteristics, operation, and use of the opt3002 evaluation module (evm). |
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2213678-4 |
TE Connectivity / Agastat |
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光电子
白炽灯和支架
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this led holder offers higher level of integration via a solderless connection to chip-on-board (cob) leds using standard pan-head and countersunk screws. |
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TPS92691QPWPRQ1 |
Texas Instruments |
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光电子
驱动器
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the tps92691/-Q1 supports continuous led status cycle switch current limit, and thermal check through the current monitor (imon) output. this allows for led short circuit or open circuit protection detection and protection. additional fault protection • tps92691-Q1: automotive q100 grade 1 features include vcc uvlo, output ovp, switch qualified cycle-by-cycle current limit, and thermal protection. |
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ENW-89849A1KF |
Panasonic |
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嵌入式解决方案
射频/无线模块
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software on a receiving device such as a smartphone app will receive this data and can perform various functions, e.g. |
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RP-SMPT08DA1 |
Panasonic |
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嵌入式解决方案
存储卡
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PT series are microsdhc memory cards adopting built-in pslc technology. this enables higher endurance/data retention and power fail robustness than mlc Nand by using 1 bit per cell in pslc mode |
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RP-SMPT04DA1 |
Panasonic |
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嵌入式解决方案
存储卡
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PT series are microsdhc memory cards adopting built-in pslc technology. this enables higher endurance/data retention and power fail robustness than mlc Nand by using 1 bit per cell in pslc mode. their operating temperature range is -40℃ to +85℃, industrial temperature range. they are formatted complying with SD card specification. |
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BT-102-50M-EQZ |
Wakefield |
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工具
化学物质
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this high bond strength adhesive is a clear 100% solids, two component, non-sag adhesive with a quick setting time of 5 minutes at room temperature. |
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BT-102-50M |
Wakefield |
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工具
化学物质
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this high bond strength adhesive is a clear 100% solids, two component, non-sag adhesive with a quick setting time of 5 minutes at room temperature. It is excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... |
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C0402C222J8JACTU |
Kemet |
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无源元器件
电容器
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the electronics industries alliance (eia) characterizes u2j dielectric as a class I material. components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. |
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C1206C473J5JACTU |
Kemet |
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无源元器件
电容器
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components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. |