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BT-301-50M-EQZ |
Wakefield |
|
工具
化学物质
|
these high bond strength adhesives are clear 100% solids, two component, non-sag adhesives with a quick setting time of 5-46 minutes at room temperature. |
|
BT-102-50M-EQZ |
Wakefield |
|
工具
化学物质
|
this high bond strength adhesive is a clear 100% solids, two component, non-sag adhesive with a quick setting time of 5 minutes at room temperature. |
|
BT-102-50M |
Wakefield |
|
工具
化学物质
|
this high bond strength adhesive is a clear 100% solids, two component, non-sag adhesive with a quick setting time of 5 minutes at room temperature. It is excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... |
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BT-02-50M |
Wakefield |
|
工具
化学物质
|
these high bond strength adhesives are clear 100% solids, two component, non-sag adhesives with a quick setting time of 5-46 minutes at room temperature. they are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... |
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MS14-2Y |
TE Connectivity |
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机电产品
继电器
|
solid state relays - industrial mount ms14 solidstate dip |
|
H3FA-B-DC5 |
Omron Automation and Safety |
|
机电产品
工业自动化
|
controllers solidstatetimer 5vdc 6-60m spst-NO/NC |
|
G3PB-515B-2N-VD DC12... |
Omron Electronics |
|
半导体
集成电路(IC)
|
固态继电器 3-phase solidstatere lay 15amps |
|
G3PB-545B-2N-VD DC12... |
Omron Electronics |
|
半导体
集成电路(IC)
|
固态继电器 3-phase solidstatere lay 45amps |
|
G3PB-545B-3N-VD DC12... |
Omron Electronics |
|
半导体
集成电路(IC)
|
固态继电器 3-phase solidstatere lay 45amps |
|
G3PB-535B-2N-VD DC12... |
Omron Electronics |
|
半导体
集成电路(IC)
|
固态继电器 3-phase solidstatere lay 35amps |