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Image: BU9408KS2 BU9408KS2 Rohm Semiconductor 集成电路 嵌入式 - DSP（数字式信号处理器） this lsi is the digital sound processor which made the use digital signal processing for fpd tvs.
Image: CYPD1120-40LQXI CYPD1120-40LQXI Cypress Semiconductor Corp 集成电路 嵌入式 -  微控制器 - 应用特定 the cypd1120 device belongs to cypress’s ccg1 product family, which provides a complete usb type-C and usb power delivery port control solution.
Image: HBL5006HT1G HBL5006HT1G ON Semiconductor 电路保护 LED保护设备 the hbl5006 series are electronic shunts which provide a current bypass in the case of leds going into open circuit. leds are by nature quite fragile when subjected to transients and surge conditions.
Image: HBL1025T1G HBL1025T1G ON Semiconductor 电路保护 LED保护设备 the hbl1015/25 series are electronic shunts which provide a current bypass in the case of leds going into open circuit. leds are by nature quite fragile when subjected to transients and surge conditions.
Image: NUD4700WSNT1G NUD4700WSNT1G ON Semiconductor 电路保护 LED保护设备 the nud4700 is an electronic shunt which provides a current bypass in the case of a single led going into open circuit. leds are by nature quite fragile when subjected to transients and surge conditions.
Image: DEV-13746 DEV-13746 ETC 集成电路 接口 - 模块 : this is the newest revision of our ftdi basic. We now use a smd 6-pin header on the bottom, which makes it smaller and more compact. functionality has remained the same.
Image: RP-SMTT64DA1 RP-SMTT64DA1 Panasonic 嵌入式解决方案 存储卡 If you think about the usage for which special quality or reliability of the products is needed and failure or malfunction of the products may directly threaten life or injury for the special usage (aeronautic or cosmic usage, military usage, combustion machine, life support applications or safety applications), please counsel with our contacts in advance.
Image: C0603X822F5JACTU C0603X822F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103F5JACTU C0603X103F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103J8JACTU C0603X103J8JACTU Kemet 无源元器件 电容器 the addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures.
Image: C0603X822J5JACTU C0603X822J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X912J5JACTU C0603X912J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X182J5JACTU C0603X182J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752J5JACTU C0603X752J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X392J5JACTU C0603X392J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X432J5JACTU C0603X432J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752G5JACTU C0603X752G5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: WAVE-45-12 WAVE-45-12 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-32-12 WAVE-32-12 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-35-12 WAVE-35-12 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.

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