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MIT420-EN |
Megger |
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测试和测量
绝缘测试器/兆欧计
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insulation testers / megohmmeters advanced cat4 600v with result storage |
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AVR1300 |
Atmel |
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Up to 12 bit resolution signed and unsigned mode result comparator |
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NTC0603-KIT |
TDK |
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附件
热敏电阻套件
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tdk thermistors have low thermal time constants which result in extremely high rates of resistance change to accurately track the temperature. |
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UTXFF4R |
Amphenol Industrial |
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连接器
太阳能连接器/电伏连接
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the total volume and characteristics of the materials used to make the utx™ have been optimized to result in a more efficient and robust design. |
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C0603X822F5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X103F5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X103J8JACTU |
Kemet |
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无源元器件
电容器
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the addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. |
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C0603X822J5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X912J5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X182J5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X752J5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X392J5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X432J5JACTU |
Kemet |
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无源元器件
电容器
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kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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C0603X752G5JACTU |
Kemet |
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无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
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GET-30569 |
California Eastern Labs |
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qualification test results on ne272 ser es |
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GET-30497 |
California Eastern Labs |
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qualification test results on Si mmic |
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GET-30704 |
California Eastern Labs |
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qualification test results on Si mmic |
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GET-BC-0006 |
California Eastern Labs |
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qualification test results on Si mmic |
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NCL30001 |
ON Semiconductor |
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嵌入式解决方案
评估板 - LED 驱动器
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the ncl30001 is a highly integrated controller for implementing power factor correction (pfc) and isolated step down ac−dc power conversion in a single stage, resulting in a lower cost and reduced part count solution. |
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Accu-P |
AVX Corporation |
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无源元器件
薄膜电容器
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the use of silicon oxide, a very low - loss dielectric material, in conjunction with highly conductive electrode metals, results in low esr and high Q. |