关键词stress
标准
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图片 型号 厂商 标准 分类 描述
Image: 747275-4 747275-4 TE Connectivity / AMP 连接器 D-Sub连接器 D-sub tools & hardware cable stress rlf 9P
Image: 747275-3 747275-3 TE Connectivity 连接器 D-Sub连接器 D-sub tools & hardware cable stress rlf 15p
Image: 747275-2 747275-2 TE Connectivity 连接器 D-Sub连接器 D-sub tools & hardware cable stress rlf 25p
Image: 747275-1 747275-1 TE Connectivity 连接器 D-Sub连接器 D-sub tools & hardware cable stress rlf 37p
Image: HT30-NISTL HT30-NISTL Extech 测试和测量 环境检测设备 environmental test equipment heat stress meter w/limitedcalibration
Image: 2220-3/4X5FT 2220-3/4X5FT 3M 工具 带 tape stress control 3/4" X 5'
Image: 2220-3/4X15FT 2220-3/4X15FT 3M 工具 带 tape stress control 3/4" X 15'
Image: 5156 5156 Pomona Electronics 电线和电缆 stress relief boot for RG 58, 141
Image: 5157 5157 Pomona Electronics 电线和电缆 stress relief boot for RG 58, 141
Image: 5155 5155 Pomona Electronics 电线和电缆 stress relief boot for RG 58, 141
Image: AB-039 AB-039 Burr Brown power amplifier stress and power HandLING limitations
Image: C0603X103J8JACTU C0603X103J8JACTU Kemet 无源元器件 电容器 the addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures.
Image: 1N5221B 1N5221B Fairchild Semiconductor 半导体 单二极管/齐纳 stresses exceeding the absolute maximum ratings may damage the device.
Image: C0603X822F5JACTU C0603X822F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103F5JACTU C0603X103F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X822J5JACTU C0603X822J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X912J5JACTU C0603X912J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X182J5JACTU C0603X182J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752J5JACTU C0603X752J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X392J5JACTU C0603X392J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.

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