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MPL135-1R5 |
Delta Electronics |
|
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big current (55a), footprint compatible with most standard, lower temperature rise at big current, low dcr, without noise |
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MPL135-R22 |
Delta Electronics |
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big current (55a), footprint compatible with most standard, lower temperature rise at big current, low dcr, without noise |
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MPL135-R47 |
Delta Electronics |
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big current (55a), footprint compatible with most standard, lower temperature rise at big current, low dcr, without noise |
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MPL135-R56 |
Delta Electronics |
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big current (55a), footprint compatible with most standard, lower temperature rise at big current, low dcr, without noise |
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MPL135-R68 |
Delta Electronics |
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big current (55a), footprint compatible with most standard, lower temperature rise at big current, low dcr, without noise |
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MPL135-R82 |
Delta Electronics |
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big current (55a), footprint compatible with most standard, lower temperature rise at big current, low dcr, without noise |
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ADS9110 |
|
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集成电路
数据采集 - 模数转换器
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small footprint: 4-mm × 4-mm vqfn |
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7SB3126 |
ON Semiconductor |
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集成电路
逻辑 - 信号开关,多路复用器,解码器
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the 7sb3126 bus switch is an advanced high−speed line switch inultra−small footprint. |
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7SB384 |
ON Semiconductor |
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集成电路
逻辑 - 信号开关,多路复用器,解码器
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the 7sb384 bus switch is an advanced high−speed line switch inultra−small footprint. |
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7SB385 |
ON Semiconductor |
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集成电路
逻辑 - 信号开关,多路复用器,解码器
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the 7sb385 bus switch is an advanced high−speed line switch inultra−small footprint. |
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7SB3125 |
ON Semiconductor |
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集成电路
逻辑 - 信号开关,多路复用器,解码器
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the 7sb3125 bus switch is an advanced high−speed line switch in ultra−small footprint. |
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ICE40UL1K-SWG16ITR50 |
Lattice Semiconductor Corporation |
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集成电路
嵌入式 - FPGA(现场可编程门阵列)
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ice40 ultraLite family is an optimum logic, smallest footprint, low I/O count ultra-low power fpga and sensor manager with instant on capability. |
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LCMXO3LF-1300E-5UWG3... |
Lattice Semiconductor Corporation |
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集成电路
嵌入式 - FPGA(现场可编程门阵列)
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smallest footprint, lowest power, high data throughput bridging solutions for mobile applications |
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LCMXO3LF-640E-5MG121... |
Lattice Semiconductor Corporation |
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集成电路
嵌入式 - FPGA(现场可编程门阵列)
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smallest footprint, lowest power, high data throughput bridging solutions for mobile applications |
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L1I0-0850150000000 |
Lumileds Lighting Company |
|
光电子
红外线数据通信
|
the luxeon IR domed line uses an industry standard footprint for ease of integration and upgrading existing system designs. |
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WAVE-40-12 |
Wakefield |
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热量管理
散热片
|
• approximately 12% better thermal performance than traditional footprint heat sinks |
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WAVE-40-125 |
Wakefield |
|
热量管理
散热片
|
• approximately 12% better thermal performance than traditional footprint heat sinks |
|
WAVE-29-127 |
Wakefield |
|
热量管理
散热片
|
• approximately 12% better thermal performance than traditional footprint heat sinks |
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WAVE-35-21 |
Wakefield |
|
热量管理
散热片
|
• approximately 12% better thermal performance than traditional footprint heat sinks |
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WAVE-34-21 |
Wakefield |
|
热量管理
散热片
|
• approximately 12% better thermal performance than traditional footprint heat sinks |