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个相关器件
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型号
厂商
标准
分类
描述
JDVGC0118
IDEA.lnc.
miniature
chip
type
designed
for
surface
mounting
and
measure
approximately
2.5 x 3 mm
JYBC0118
IDEA.lnc.
miniature
chip
type
designed
for
surface
mounting
and
measure
approximately
2.5 x 3 mm
JYOBC0118
IDEA.lnc.
miniature
chip
type
designed
for
surface
mounting
and
measure
approximately
2.5 x 3 mm
JYGC0118
IDEA.lnc.
miniature
chip
type
designed
for
surface
mounting
and
measure
approximately
2.5 x 3 mm
BRUS7
Electronic devices inc.
ultra
-
fast
recovery
approximately
25
amperes
single
-
phase
,
full
-
wave
bridges
BRUS705
Electronic devices inc.
ultra
-
fast
recovery
approximately
25
amperes
single
-
phase
,
full
-
wave
bridges
BRUS710
Electronic devices inc.
ultra
-
fast
recovery
approximately
25
amperes
single
-
phase
,
full
-
wave
bridges
BRUS720
Electronic devices inc.
ultra
-
fast
recovery
approximately
25
amperes
single
-
phase
,
full
-
wave
bridges
BRUS740
Electronic devices inc.
ultra
-
fast
recovery
approximately
25
amperes
single
-
phase
,
full
-
wave
bridges
BRUS750
Electronic devices inc.
ultra
-
fast
recovery
approximately
25
amperes
single
-
phase
,
full
-
wave
bridges
BRUS760
Electronic devices inc.
ultra
-
fast
recovery
approximately
25
amperes
single
-
phase
,
full
-
wave
bridges
WAVE-40-12
Wakefield
热量管理
散热片
•
approximately
12%
better
thermal
performance
than
traditional
footprint
heat
sinks
WAVE-40-125
Wakefield
热量管理
散热片
•
approximately
12%
better
thermal
performance
than
traditional
footprint
heat
sinks
WAVE-29-127
Wakefield
热量管理
散热片
•
approximately
12%
better
thermal
performance
than
traditional
footprint
heat
sinks
WAVE-35-21
Wakefield
热量管理
散热片
•
approximately
12%
better
thermal
performance
than
traditional
footprint
heat
sinks
WAVE-34-21
Wakefield
热量管理
散热片
•
approximately
12%
better
thermal
performance
than
traditional
footprint
heat
sinks
5344318
5344319
5344321
5344329
7870679
7870680
7870681
7870682
7870683
7870684
7870685
8073859
8073860
8073861
8073862
8073863