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图片 型号 厂商 标准 分类 描述
Image: 7SB3126 7SB3126 ON Semiconductor 集成电路 逻辑 - 信号开关，多路复用器，解码器 the 7sb3126 bus switch is an advanced high−speed line switch inultra−small footprint.
Image: 7SB384 7SB384 ON Semiconductor 集成电路 逻辑 - 信号开关，多路复用器，解码器 the 7sb384 bus switch is an advanced high−speed line switch inultra−small footprint.
Image: 7SB385 7SB385 ON Semiconductor 集成电路 逻辑 - 信号开关，多路复用器，解码器 the 7sb385 bus switch is an advanced high−speed line switch inultra−small footprint.
Image: 7SB3125 7SB3125 ON Semiconductor 集成电路 逻辑 - 信号开关，多路复用器，解码器 the 7sb3125 bus switch is an advanced high−speed line switch in ultra−small footprint.
Image: ICE40UL1K-SWG16ITR50 ICE40UL1K-SWG16ITR50 Lattice Semiconductor Corporation 集成电路 嵌入式 - FPGA（现场可编程门阵列） ice40 ultraLite family is an optimum logic, smallest footprint, low I/O count ultra-low power fpga and sensor manager with instant on capability.
Image: LCMXO3LF-1300E-5UWG36CTR50 LCMXO3LF-1300E-5UWG3... Lattice Semiconductor Corporation 集成电路 嵌入式 - FPGA（现场可编程门阵列） smallest footprint, lowest power, high data throughput bridging solutions for mobile applications
Image: LCMXO3LF-640E-5MG121I LCMXO3LF-640E-5MG121... Lattice Semiconductor Corporation 集成电路 嵌入式 - FPGA（现场可编程门阵列） smallest footprint, lowest power, high data throughput bridging solutions for mobile applications
Image: L1I0-0850150000000 L1I0-0850150000000 Lumileds Lighting Company 光电子 红外线数据通信 the luxeon IR domed line uses an industry standard footprint for ease of integration and upgrading existing system designs.
Image: WAVE-40-12 WAVE-40-12 Wakefield 热量管理 散热片 • approximately 12% better thermal performance than traditional footprint heat sinks
Image: WAVE-40-125 WAVE-40-125 Wakefield 热量管理 散热片 • approximately 12% better thermal performance than traditional footprint heat sinks
Image: WAVE-29-127 WAVE-29-127 Wakefield 热量管理 散热片 • approximately 12% better thermal performance than traditional footprint heat sinks
Image: WAVE-35-21 WAVE-35-21 Wakefield 热量管理 散热片 • approximately 12% better thermal performance than traditional footprint heat sinks
Image: WAVE-34-21 WAVE-34-21 Wakefield 热量管理 散热片 • approximately 12% better thermal performance than traditional footprint heat sinks
Image: WAVE-45-12 WAVE-45-12 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-32-12 WAVE-32-12 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-35-12 WAVE-35-12 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-35-15 WAVE-35-15 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-425-117 WAVE-425-117 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-35-125 WAVE-35-125 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area.
Image: WAVE-366-175 WAVE-366-175 Wakefield 热量管理 散热片 the wakefield-vette wave series heat sink series are a superior choice for cooling bga applications in which limited height/footprint while achieving maximum surface area

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