关键词bumped
标准
为您共找出"57"个相关器件
图片 型号 厂商 标准 分类 描述
Image: EPC1007 EPC1007 EPC 半导体 FET - 单 trans gan 100v 6A bumped die
Image: EPC1009 EPC1009 EPC 半导体 FET - 单 trans gan 60v 6A bumped die
Image: EPC1010 EPC1010 EPC 半导体 FET - 单 trans gan 200v 12a bumped die
Image: EPC1011 EPC1011 EPC 半导体 FET - 单 trans gan 150v 12a bumped die
Image: EPC1012 EPC1012 EPC 半导体 FET - 单 trans gan 200v 3A bumped die
Image: EPC1013 EPC1013 EPC 半导体 FET - 单 trans gan150v 3A bumped die
Image: EPC1014 EPC1014 EPC 半导体 FET - 单 trans gan 40v 10a bumped die
Image: EPC1015 EPC1015 EPC 半导体 FET - 单 trans gan 40v 33a bumped die
Image: SL2ICS1001DW/V4,00 SL2ICS1001DW/V4,00 NXP Semiconductors 半导体 集成电路(IC) 数据转换系统 smrt label IC bumped wafer specification
Image: ATA555814-DBB ATA555814-DBB Atmel 半导体 集成电路(IC) 射频无线杂项 210pf bumped
Image: TLV5614IYZ TLV5614IYZ Texas Instruments 半导体 2.7 V to 5.5V 12-bit lead-free/green dac in bumped-die (wafer chip scale) package 16-dsbga -40 to 85
Image: MF1ICS2005 MF1ICS2005 NXP Semiconductors sawn bumped 120レm wafer addendum
Image: MF1ICS2005U7D MF1ICS2005U7D NXP Semiconductors sawn bumped 120レm wafer addendum
Image: MF1ICS2005W7D MF1ICS2005W7D NXP Semiconductors sawn bumped 120レm wafer addendum
Image: MF1ICS5005 MF1ICS5005 Philips Semiconductors standard card IC specification “bumped sawn wafer on UV-tape”
Image: MF1ICS5005V1D MF1ICS5005V1D Philips Semiconductors standard card IC specification “bumped sawn wafer on UV-tape”
Image: MF1ICS5005W1D MF1ICS5005W1D Philips Semiconductors standard card IC specification “bumped sawn wafer on UV-tape”

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