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为您共找出"137"个相关器件
图片 型号 厂商 标准 分类 描述
Image: N-08-18-0-M-LC N-08-18-0-M-LC Molex 195.58mm (7.700") UV black cable tie, 18 pound tensile strength, 1000/bag
Image: N-08-18-9-M-LC N-08-18-9-M-LC Molex 195.58mm (7.700") natural cable tie, 18 pound tensile strength, 1000/bag
Image: TC9208 TC9208 Toshiba Semiconductor and Storage high tension sustaining analog function switch
Image: TC9208N TC9208N Toshiba Semiconductor and Storage high tension sustaining analog function switch
Image: TC9209N TC9209N Toshiba Semiconductor and Storage high tension sustaining analog function switch
Image: ELAF ELAF TE Connectivity 传感器，变送器 力传感器 the elaf series compression and tension load.
Image: C0603X822F5JACTU C0603X822F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103F5JACTU C0603X103F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X822J5JACTU C0603X822J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X912J5JACTU C0603X912J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X182J5JACTU C0603X182J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752J5JACTU C0603X752J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X392J5JACTU C0603X392J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X432J5JACTU C0603X432J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752G5JACTU C0603X752G5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: i.MX RT600 i.MX RT600 NXP Semiconductors 半导体 微控制器和微处理器 i.MX rt600是一个交叉处理器家族的32位身临其境音频回放和语音用户界面应用了高性能的cadence组合优化® tensilica的®的Hi-Fi音频4 dsp核心与下一代的cortex-m33芯。
Image: i.MX RT600 i.MX RT600 NXP Semiconductors 集成电路 嵌入式 -  微控制器或微处理器模块 总览 的i.MX rt600是交叉mcu系列为32位身临其境音频回放和语音用户界面的应用程序结合了高性能的cadence优化® tensilica的®与下一代的cortex-m33芯高保真4音频dsp核心。i.MX rt600交叉mcu系列旨在通过安全，功耗优化的嵌入式处理器来释放语音辅助终端节点的潜力。 i.MX rt600系列提供高达4.5mb的片上sram和几个高带宽接口，以访问片外闪存，包括具有动态解密引擎的八通道/四通道spi接口。此外，该系列还提供了丰富的外围设备，edgelock 400a安全性*和极低的功耗，并具有降低的功耗模式和更快的唤醒时间。 *结合了edgelock 400a安全性的设备支持多种片上安全性功能，并基于旨在抵御远程和本地软件攻击的安全启动，安全调试和安全生命周期管理的基础上构建。

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