|
C0603X822J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X912J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X182J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X752J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X392J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X432J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X752G5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
11-32-0807 |
Molex |
|
工具
|
hand tools low product sensor P W product sensor pkg |
|
V62/07649-02XA |
Texas Instruments |
|
半导体
集成电路 - IC
|
digital signal processors & controllers - dsp, dsc enh product fixed-Pt dig signal proc |
|
SM320C6455BGTZSEP |
Texas Instruments |
|
半导体
集成电路 - IC
|
digital signal processors & controllers - dsp, dsc enh product fixed- Pt dig signal proc |
|
SM320C6455BGTZEP |
Texas Instruments |
|
半导体
集成电路 - IC
|
digital signal processors & controllers - dsp, dsc enh product fixed- Pt dig signal proc |
|
V62/07649-01XA |
Texas Instruments |
|
半导体
集成电路 - IC
|
digital signal processors & controllers - dsp, dsc enh product fixed-Pt dig signal proc |
|
T049016 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product tube assembly 3310 C |
|
T050013 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product reel assembly |
|
T050014 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product reel assembly |
|
T049018 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product tube assembly |
|
T050012 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product reel assembly |
|
T049032 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product tube assembly |
|
T049015 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product tube assembly 3310 P R Y |
|
T049001 |
Bourns Inc. |
|
电路保护
电路保护套件
|
circuit protection kits product tube kit 3362mswxz |