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Image: 51146-0200 51146-0200 MolexKits includes clik-mate, Panelmate,sherlock, pico-spox and microclasp prodcut
Image: 51146-0600 51146-0600 MolexKits includes clik-mate, Panelmate,sherlock, pico-spox and microclasp prodcut
Image: 51146-0900 51146-0900 MolexKits includes clik-mate, Panelmate,sherlock, pico-spox and microclasp prodcut
Image: 50641-8141 50641-8141 MolexKits includes clik-mate, Panelmate,sherlock, pico-spox and microclasp prodcut
Image: 63811-7900 63811-7900 MolexKits includes clik-mate, Panelmate,sherlock, pico-spox and microclasp prodcut
Image: 63819-2800 63819-2800 MolexKits includes clik-mate, Panelmate,sherlock, pico-spox and microclasp prodcut
Image: HS4318ESS01H HS4318ESS01H Renata microcomputer designed to increase program productivity
Image: 57404-5300 57404-5300 MolexKits includes clik-mate, Panelmate,sherlock, pico-spox and microclasp prodcut
Image: HS4318ESH01H HS4318ESH01H Renata microcomputer designed to increase program productivity
Image: LMV227 LMV227 Texas Instruments 半导体 production RF tested, RF power detector for cdma and Wcdma 6-wson
Image: SF2110D SF2110D RF Monolithics, Inc for prototype or pre-production sample please contact rfm sales
Image: LSP05G240PX3316 LSP05G240PX3316 Littelfuse Inc 电路保护 LED保护设备 It also provides high line-to-earth/ground resistance, facilitating faster production line testing
Image: C0603X822F5JACTU C0603X822F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103F5JACTU C0603X103F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X822J5JACTU C0603X822J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X912J5JACTU C0603X912J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X182J5JACTU C0603X182J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752J5JACTU C0603X752J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X392J5JACTU C0603X392J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X432J5JACTU C0603X432J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.

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