关键词packag
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为您共找出"500+"个相关器件
图片 型号 厂商 标准 分类 描述
Image: SGM4684 SGM4684 Shengbang Microelectronics Co, Ltd chip scale packaging, low-voltage 0.4??, dual, spdt analog switch
Image: EMD5 EMD5 ROHM Semiconductor 半导体 packaging specifications
Image: 0876021191 0876021191 Molex 2.50mm(.098") pitch panel detachable connector, pcb header, vertical, 12 circuits0.5??m (20??") gold (Au) selective plating, with locating pegs, tube packaging, leadfree
Image: 0879112211 0879112211 Molex 2.54mm (.100) pitch C-grid? header, right angle, through hole, 22 circuits, 0.38??m (15??) gold (Au) selective plating, tube packaging, lead-free
Image: 52207-2960 52207-2960 Molex 1.00mm (.039") pitch ffc/fpc connector, smt, right angle, zif, top contact stylereceptacle, 29 circuits, lead-free, gold contact plating, high barrier packaging
Image: 0536250574 0536250574 Molex 0.635mm (.025") pitch Slimstack? header, surface mount, dual row, Verticalstacking, 13.00mm (.512") stack height, lead-free, 50 circuits, with embossed Tapewith cover packaging
Image: MR25MPA-10K-F MR25MPA-10K-F RFE international packaging specifications avisert (av3) & panasert (PA) specifications
Image: MR25MAV3-10K-F MR25MAV3-10K-F RFE international packaging specifications avisert (av3) & panasert (PA) specifications
Image: 643221359 643221359 Molex female terminal, tin plated, selective 0.8??m gold in contact area, for square 0.6mm x 0.6mm pins, wire size 0.22mm?; to 0.44mm?awg, packaging on reel - "in laddestrip pitch 7.0mmr
Image: 0522711379 0522711379 Molex 1.00mm (.039") pitch ffc/fpc connector, right angle, smt, zif, bottom contactstyle, 13 circuits, lead-free, high barrier packaging
Image: 643221339 643221339 Molex female terminal, tin plated, selective 0.8??m gold in contact area, for square 0.6mmx 0.6mm pins, wire size 0.75mm? awg, packaging on reel - "in ladder strip pitch7.0mm"
Image: 0522711879 0522711879 Molex 1.00mm (.039") pitch ffc/fpc connector, right angle, smt, zif, bottom contactstyle, 18 circuits, lead-free, high barrier packaging
Image: TPS62674YFD TPS62674YFD Texas Instruments 半导体 500-mA, 6-mhz high-efficiency step-down converter IN low profile chip scale packaging
Image: TO-220 TO-220 ROHM Semiconductor packaging specifications
Image: TPS61256 TPS61256 Texas Instruments 半导体 3.5-mhz high efficiency step-Up converter In chip scale packaging. 5V output voltage 9-dsbga -40 to 85
Image: TPS62690 TPS62690 Texas Instruments 半导体 500-mA, 4-mhz, 2.85-vout high-efficiency step-down converter in chip scale packaging 6-dsbga -40 to 85
Image: TPS77150 TPS77150 Texas Instruments 半导体 150-mA ldo regulators with 8-pin msop packaging
Image: TPS61253 TPS61253 Texas Instruments 半导体 3.5-mhz high efficiency step-Up converter In chip scale packaging. 5V output voltage 9-dsbga -40 to 85
Image: TPS62650 TPS62650 Texas Instruments 半导体 800-mA, 6-mhz synchronous step-down converter in chip scale packaging 9-dsbga -40 to 85
Image: TPS62691 TPS62691 Texas Instruments 半导体 电源管理 600-mA, 4-mhz, 2.2-vout high-efficiency step-down converter in chip scale packaging 6-dsbga -40 to 85

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