|
C0603X822F5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X103F5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X103G5JACTU |
Kemet |
|
无源元器件
电容器
|
although flexible termination technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems. |
|
C0603X822J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X912J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X182J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X752J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X392J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X432J5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
C0603X752G5JACTU |
Kemet |
|
无源元器件
电容器
|
kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. |
|
TPS65197BRUYR |
Texas Instruments |
|
|
tps65197x: 8-channel level-shifter supporting No, 2-channel and 3-channel charge-sharing with panel Discharge to vgh during shut-down datasheet (rev. D) |
|
TPS65197BRUYT |
Texas Instruments |
|
|
tps65197x: 8-channel level-shifter supporting No, 2-channel and 3-channel charge-sharing with panel Discharge to vgh during shut-down datasheet (rev. D) |