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"187"
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图片
型号
厂商
标准
分类
描述
C0603X822J5JACTU
Kemet
无源元器件
电容器
kemet
’s
high
voltage
with
flex
ible
termination
(HV FT-
cap
)
surface
mount
mlccs
in
x7r
dielectric
address
the
primary
failure
mode
of
mlccs
–
flex
cracks
,
which
are
typically
the
result
of
excessive
tensile
and
shear
stresses
produced
during
board
flex
ure
and
the
rmal
cycling
.
C0603X912J5JACTU
Kemet
无源元器件
电容器
kemet
’s
high
voltage
with
flex
ible
termination
(HV FT-
cap
)
surface
mount
mlccs
in
x7r
dielectric
address
the
primary
failure
mode
of
mlccs
–
flex
cracks
,
which
are
typically
the
result
of
excessive
tensile
and
shear
stresses
produced
during
board
flex
ure
and
the
rmal
cycling
.
C0603X182J5JACTU
Kemet
无源元器件
电容器
kemet
’s
high
voltage
with
flex
ible
termination
(HV FT-
cap
)
surface
mount
mlccs
in
x7r
dielectric
address
the
primary
failure
mode
of
mlccs
–
flex
cracks
,
which
are
typically
the
result
of
excessive
tensile
and
shear
stresses
produced
during
board
flex
ure
and
the
rmal
cycling
.
C0603X752J5JACTU
Kemet
无源元器件
电容器
kemet
’s
high
voltage
with
flex
ible
termination
(HV FT-
cap
)
surface
mount
mlccs
in
x7r
dielectric
address
the
primary
failure
mode
of
mlccs
–
flex
cracks
,
which
are
typically
the
result
of
excessive
tensile
and
shear
stresses
produced
during
board
flex
ure
and
the
rmal
cycling
.
C0603X392J5JACTU
Kemet
无源元器件
电容器
kemet
’s
high
voltage
with
flex
ible
termination
(HV FT-
cap
)
surface
mount
mlccs
in
x7r
dielectric
address
the
primary
failure
mode
of
mlccs
–
flex
cracks
,
which
are
typically
the
result
of
excessive
tensile
and
shear
stresses
produced
during
board
flex
ure
and
the
rmal
cycling
.
C0603X432J5JACTU
Kemet
无源元器件
电容器
kemet
’s
high
voltage
with
flex
ible
termination
(HV FT-
cap
)
surface
mount
mlccs
in
x7r
dielectric
address
the
primary
failure
mode
of
mlccs
–
flex
cracks
,
which
are
typically
the
result
of
excessive
tensile
and
shear
stresses
produced
during
board
flex
ure
and
the
rmal
cycling
.
C0603X752G5JACTU
Kemet
无源元器件
电容器
kemet
’s
high
voltage
with
flex
ible
termination
(HV FT-
cap
)
surface
mount
mlccs
in
x7r
dielectric
address
the
primary
failure
mode
of
mlccs
–
flex
cracks
,
which
are
typically
the
result
of
excessive
tensile
and
shear
stresses
produced
during
board
flex
ure
and
the
rmal
cycling
.
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