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为您共找出"146"个相关器件
图片 型号 厂商 标准 分类 描述
Image: 1-102396-3 1-102396-3 TE Connectivity 连接器 矩形连接器 - 配件 conn cover 30pos 2 required
Image: EC2-20-26.800M EC2-20-26.800M Ecliptek 无源元器件 频率控制器和定时装置 晶体 26.800mhz 20pf **quote required**
Image: EC2-20-4.000M EC2-20-4.000M Ecliptek 无源元器件 频率控制器和定时装置 晶体 4mhz 20pf **quote required**
Image: EC1SMA-10-25.00M EC1SMA-10-25.00M Ecliptek 无源元器件 频率控制器和定时装置 晶体 25mhz crystal **quote required**
Image: EC2A-16-20.000MHZ EC2A-16-20.000MHZ Ecliptek 无源元器件 频率控制器和定时装置 晶体 20mhz 16pf **quote required**
Image: MC34063A MC34063A Estek Electronics Co. Ltd monolithic control circuit containing the primary functions required for DC-to-DC converters
Image: MFP0507S MFP0507S Interpoint Corporation Company No external components required operating temperature -70？° to +150？°C
Image: 34063A 34063A Estek Electronics Co. Ltd monolithic control circuit containing the primary functions required for DC-to-DC converters
Image: 200110MS 200110MS SUYIN USA, INC. 2.0mm single row header straight P.C.B. mount type easy bend & break TO required number OF pins
Image: ECQV1274JM ECQV1274JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1273JM ECQV1273JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: 2500AT43A0100 2500AT43A0100 Johanson Technology Inc. 2.5ghz chip antenna (No gnd clearance required)
Image: ECQV1184JM ECQV1184JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1183JM ECQV1183JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1223JM ECQV1223JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1224JM ECQV1224JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1563JM ECQV1563JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1J473JM ECQV1J473JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1J104JM ECQV1J104JM Panasonic Semiconductor designed for application where high density insertion of components is required.
Image: ECQV1J103JM ECQV1J103JM Panasonic Semiconductor designed for application where high density insertion of components is required.

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