|
CR2AM-8A |
Mitsubishi Electric |
|
|
low power use glass passivation type |
|
|
BCR3KM-12 |
Mitsubishi Electric |
|
|
low power use insulated type, planar passivation type |
|
|
CR02AM |
Mitsubishi Electric |
|
|
low power use planar passivation type |
|
|
CR02AM-4 |
Mitsubishi Electric |
|
|
low power use planar passivation type |
|
|
X46402 |
Xicor Inc. |
|
|
dual voltage cpu supervisor with 64k password protected eeprom |
|
|
X46402V8-2.9 |
Xicor Inc. |
|
|
dual voltage cpu supervisor with 64k password protected eeprom |
|
|
X46402V8-3.1 |
Xicor Inc. |
|
|
dual voltage cpu supervisor with 64k password protected eeprom |
|
|
X46402V8-3.1A |
Xicor Inc. |
|
|
dual voltage cpu supervisor with 64k password protected eeprom |
|
|
X46402V8E-2.9 |
Xicor Inc. |
|
|
dual voltage cpu supervisor with 64k password protected eeprom |
|
|
X46402V8E-3.1 |
Xicor Inc. |
|
|
dual voltage cpu supervisor with 64k password protected eeprom |
|
|
X46402V8E-3.1A |
Xicor Inc. |
|
|
dual voltage cpu supervisor with 64k password protected eeprom |
|
|
521F |
ETC |
|
|
solder pastes/cleaner |
|
|
QL2009-1PQ208I |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
|
|
QL2009-2PB256C |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
|
|
QL2009-2PB256I |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
|
|
QL2009-2PF144C |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
|
|
QL2009-2PF144I |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
|
|
QL2009-2PQ208C |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
|
|
QL2009-2PQ208I |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
|
|
QL2009-XPB256C |
ETC |
|
|
3.3V and 5.0V pasic? 2 fpga combining speed, density, low cost and flexibility |
