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HP6-189S-1.27DS |
Hirose Electric Co Ltd |
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high-density packaging system |
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TPS62305DRCRG4 |
Texas Instruments |
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500-mA, 3-mhz synchronous step-down converter IN chip scale packaging |
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TPS62302DRCRG4 |
Texas Instruments |
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500-mA, 3-mhz synchronous step-down converter IN chip scale packaging |
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TPS62651YFF |
Texas Instruments |
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半导体
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800-mA 6-mhz high-efficiency step-down converter with i2ctm compatible interface IN chip scale packaging |
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TPS62351YZG |
Texas Instruments |
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半导体
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800-mA, 3-mhz synchronous step-down converter with i2c⑩ compatible interface IN chip scale packaging |
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TEMD5 |
ROHM Semiconductor |
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packaging specifications |
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TPS62601YFF |
Texas Instruments |
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半导体
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500-mA, 6-mhz synchronous step-down converter IN chip scale packaging |
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0879144616 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 46 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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0879144816 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 48 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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0879144204 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 0.38??m (15??) gold (Au) plating, tray packaging, lead-free |
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0879144201 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 0.38??m (15??) gold (Au) plating, tray packaging, lead-free |
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0879144216 |
Molex |
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2.54mm (.100) pitch C-grid? header, through hole, dual row, vertical, 42 circuits, 2.50??m (98.4??) tin (Sn) overall Plating, tray packaging, lead-free |
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87920-8147 |
Molex |
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2.54mm (.100) pitch C-grid? header, surface mount, dual row, vertical, 14 circuits, 0.38??m (15??) gold (Au) plating, with pick-and-place cap, with peg, tube packaging |
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0879114611 |
Molex |
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2.54mm (.100) pitch C-grid? header, right angle, through hole, 46 circuits, 0.38??m (15??") gold (Au) selective plating, tube packaging, lead-free |
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UMD4 |
ROHM Semiconductor |
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packaging specifications |
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UMD5 |
ROHM Semiconductor |
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packaging specifications |
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UMD6 |
ROHM Semiconductor |
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半导体
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packaging specifications |
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0527461171 |
Molex |
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0.50mm (.020") pitch ffc/fpc connector, right angle, smt, zif, bottom contactStyle, 11 circuits, lead-free, gold contact plating, high barrier packaging |
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SGM4684XG/TR |
Shengbang Microelectronics Co, Ltd |
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chip scale packaging, low-voltage 0.4??, dual, spdt analog switch |
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UMD2 |
ROHM Semiconductor |
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packaging specifications |
