关键词metal
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图片 型号 厂商 标准 分类 描述
Image: MGDSI-10-C-C MGDSI-10-C-C ETC 2:1 standard input single & Bi outputs metallic case - 1.500 vdc isolation
Image: MGDSI-10-C-E MGDSI-10-C-E ETC 2:1 standard input single & Bi outputs metallic case - 1.500 vdc isolation
Image: MGDSI-10-C-F MGDSI-10-C-F ETC 2:1 standard input single & Bi outputs metallic case - 1.500 vdc isolation
Image: CGY52 CGY52 Siemens Semiconductor Group gaas mmic (two stages monolithic microwave IC mmicAmplifier all gold metallisation)
Image: 1N970B 1N970B Compensated Deuices Incorporated metallurgically bonded
Image: 1N970B-1 1N970B-1 Compensated Deuices Incorporated metallurgically bonded
Image: 1N970C 1N970C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N970D 1N970D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N980C 1N980C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N980D 1N980D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N981 1N981 Microsemi Corporation metallurgically bonded double plug construction
Image: 1N981A 1N981A Microsemi Corporation metallurgically bonded double plug construction
Image: 1N957B 1N957B Compensated Deuices Incorporated metallurgically bonded
Image: 1N957C 1N957C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N958D 1N958D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N959A 1N959A Microsemi Corporation metallurgically bonded double plug construction
Image: 1N959B 1N959B Compensated Deuices Incorporated metallurgically bonded
Image: 1N959C 1N959C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N959D 1N959D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N974D 1N974D Microsemi Corporation metallurgically bonded double plug construction

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