关键词failure
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为您共找出"177"个相关器件
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Image: WED7G176IDE36ADC25 WED7G176IDE36ADC25 White Electronic Designs Corporation dimmdrive solid state ide flash module with power failure protection ide36 dimmdrive solid state ide flash module ide33
Image: MAX6684 MAX6684 Maxim Integrated 半导体 fan-failure detector with integrated power switch
Image: MAX6684ESA MAX6684ESA Maxim Integrated 半导体 fan-failure detector with integrated power switch
Image: G3PC_07 G3PC_07 Omron Electronics ssr with failure detection function
Image: G3PC-220B-VD G3PC-220B-VD Omron Electronics ssr with failure detection function
Image: LSP05G240PX3333 LSP05G240PX3333 Littelfuse Inc 电路保护 LED保护设备 It has been developed with littelfuse’s thermally protected varistor technology. its built-in thermal disconnect function provides additional protection to prevent catastrophic failure and fire hazard even under extreme circumstances of varistor end-oflife or sustained over-voltage conditions.
Image: RP-SMTT64DA1 RP-SMTT64DA1 Panasonic 嵌入式解决方案 存储卡 If you think about the usage for which special quality or reliability of the products is needed and failure or malfunction of the products may directly threaten life or injury for the special usage (aeronautic or cosmic usage, military usage, combustion machine, life support applications or safety applications), please counsel with our contacts in advance.
Image: C0603X822F5JACTU C0603X822F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103F5JACTU C0603X103F5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X822J5JACTU C0603X822J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X912J5JACTU C0603X912J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X182J5JACTU C0603X182J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752J5JACTU C0603X752J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X392J5JACTU C0603X392J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X432J5JACTU C0603X432J5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X752G5JACTU C0603X752G5JACTU Kemet 无源元器件 电容器 kemet’s high voltage with flexible termination (HV FT-cap) surface mount mlccs in x7r dielectric address the primary failure mode of mlccs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
Image: C0603X103J8JACTU C0603X103J8JACTU Kemet 无源元器件 电容器 the addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures.

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