|
HW-MP-VQ44-2 |
Xilinx Inc |
|
嵌入式解决方案
配件
|
adapter 44-vqfp coolrunner II |
|
410-146P-KIT |
Digilent, Inc. |
|
嵌入式解决方案
评估板 - 嵌入式 - 复杂逻辑器件 (FPGA, CPLD)
|
kit starter coolrunner-II |
|
HW-CRII-SK-G |
Xilinx Inc |
|
嵌入式解决方案
评估板 - 嵌入式 - 复杂逻辑器件 (FPGA, CPLD)
|
kit starter coolrunner-II webpak |
|
HW-CRII-SK-G-PROMO |
Xilinx Inc |
|
嵌入式解决方案
评估板 - 嵌入式 - 复杂逻辑器件 (FPGA, CPLD)
|
kit starter coolrunner-II |
|
SK-CRII-L-G |
Xilinx Inc |
|
嵌入式解决方案
评估板 - 嵌入式 - 复杂逻辑器件 (FPGA, CPLD)
|
kit starter coolrunner-II LP/LC |
|
A22N-MR166 |
Omron Automation and Safety |
|
机电产品
配件
|
off-coolant-ON |
|
A22N-PR166 |
Omron Automation and Safety |
|
机电产品
配件
|
off-coolant-ON |
|
A22N-PS166 |
Omron Automation and Safety |
|
机电产品
配件
|
off-coolant-ON |
|
A22N-PX166 |
Omron Automation and Safety |
|
机电产品
配件
|
off-coolant-ON |
|
3CW10000H3 |
Communications & Power Industries, Inc. |
|
|
the 3cw10,000h3 is a water cooled, ceramic/metal, medium-mu power triode |
|
3CW20000H3 |
Communications & Power Industries, Inc. |
|
|
the 3cw20,000h3 is a water cooled, ceramic/ metal, medium-mu power triode |
|
3CW30000H3 |
Communications & Power Industries, Inc. |
|
|
the 3cw30,000h3 is a water cooled, ceramic/ metal, medium-mu power triode |
|
37717-0001 |
Molex |
|
|
coolfin?? heat sink with integrated heat pipes |
|
37717-1001 |
Molex |
|
|
coolfin?? heat sink with integrated heat pipes |
|
2214-30SL |
JDS Uniphase Corporation |
|
|
air-cooled argon-ion laser heads in cylindrical and rectangular packages |
|
2214-4VL |
JDS Uniphase Corporation |
|
|
air-cooled argon-ion laser heads in cylindrical and rectangular packages |
|
2218-010MLS |
JDS Uniphase Corporation |
|
|
air-cooled argon ion laser heads in cylindrical and rectangular packages |
|
2218-010SLS |
JDS Uniphase Corporation |
|
|
air-cooled argon ion laser heads in cylindrical and rectangular packages |
|
2218-020MLS |
JDS Uniphase Corporation |
|
|
air-cooled argon ion laser heads in cylindrical and rectangular packages |
|
2218-020SLS |
JDS Uniphase Corporation |
|
|
air-cooled argon ion laser heads in cylindrical and rectangular packages |