关键词construct
标准
为您共找出"319"个相关器件
图片 型号 厂商 标准 分类 描述
Image: 1N755A 1N755A Compensated Deuices Incorporated double plug construction
Image: 1N756A 1N756A Compensated Deuices Incorporated double plug construction
Image: 1N976C 1N976C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N976D 1N976D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N4002G 1N4002G Philips Semiconductors rectifiers(rugged glass package, using a high temperature alloyed construction)
Image: 1N977A 1N977A Microsemi Corporation metallurgically bonded double plug construction
Image: 1N977C 1N977C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N977D 1N977D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N978A 1N978A Microsemi Corporation metallurgically bonded double plug construction
Image: 1N757A 1N757A Compensated Deuices Incorporated double plug construction
Image: 1N758A 1N758A Compensated Deuices Incorporated double plug construction
Image: 1N759A 1N759A Compensated Deuices Incorporated double plug construction
Image: 1N978C 1N978C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N978D 1N978D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N4003G 1N4003G Philips Semiconductors rectifiers(rugged glass package, using a high temperature alloyed construction)
Image: 1N979C 1N979C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N979D 1N979D Microsemi Corporation metallurgically bonded double plug construction
Image: 1N981C 1N981C Microsemi Corporation metallurgically bonded double plug construction
Image: 1N4004G 1N4004G Philips Semiconductors rectifiers(rugged glass package, using a high temperature alloyed construction)
Image: 1N981D 1N981D Microsemi Corporation metallurgically bonded double plug construction

©2000-  21IC电子网版权所有

京ICP备11013301号 京公网安备 11010802024343号