|
4B88ABH1K09600 |
Laird Technologies EMI |
|
无源元器件
RFI 和 EMI - 屏蔽和吸收材料
|
GK nicu nrs PU V0 bell |
|
4633-AF-51H-01800 |
Laird Technologies |
|
无源元器件
EMI/RFI 器件
|
emi 垫圈与接地垫 fabricoverfoam bell L 18 xW .30 xH .10 |
|
MTMMC-C-N12.R2 |
Multi-Tech Systems |
|
嵌入式解决方案
射频/无线模块和开发工具
|
wifi/802.11 模块和开发工具 800/1900 cdma 1xrtt bell mob mmcmodem-5V |
|
MTMMC-C-N12.R2-SP |
Multi-Tech Systems |
|
嵌入式解决方案
射频/无线模块和开发工具
|
wifi/802.11 模块和开发工具 800/1900 cdma 1xrtt bell mob mmcmodem-5V |
|
4882-AB-51H-01800 |
Laird Technologies |
|
无源元器件
EMI/RFI 器件
|
emi 垫圈与接地垫 fabricoverfoam bell L 18 xW .60 xH .12 |
|
73K222AL-IGT |
TDK |
|
|
V.22, V.21, bell 212a, 103 single-chip modem |
|
73K222AL-IP |
TDK |
|
|
V.22, V.21, bell 212a, 103 single-chip modem |
|
73K222AL-IH |
TDK |
|
|
V.22, V.21, bell 212a, 103 single-chip modem |
|
73K222AL |
TDK |
|
|
V.22, V.21, bell 212a, 103 single-chip modem |
|
KA2410 |
Samsung semiconductor |
|
|
the ka2410/ka2411 IS A bipolar integrated circuit designed for telephone bell replacement |
|
KA2411 |
Samsung semiconductor |
|
|
the ka2410/ka2411 IS A bipolar integrated circuit designed for telephone bell replacement |
|
M60 |
ETC |
|
|
door bell dual tone |
|
M602 |
ETC |
|
|
door bell dual tone |
|
M602P |
ETC |
|
|
door bell dual tone |
|
M60P |
ETC |
|
|
door bell dual tone |
|
M3D-95 |
ETC |
|
|
3 state dual tones wireless door bell |
|
M3E.-H |
ETC |
|
|
3 state dual tones wireless door bell |
|
MT3530 |
Zarlink Semiconductor Inc |
|
|
bell 103/V.21 single chip modem |
|
MT3530BE |
Zarlink Semiconductor Inc |
|
|
bell 103/V.21 single chip modem |
|
73K324L |
ETC |
|
|
ccitt V.22bis, V.22, V.21, V.23, bell 212a single-chip modem |