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| 型号： | OMAP3525ECBB |
| 厂商： |
 Texas Instruments |
| 标准： |   |
| 分类： | 半导体 ， 集成电路 - IC |
| 描述： | processors - application specialized applications proc |
| 报错 收藏 赞 | |
OMAP3525ECBB的详细信息
| Manufacturer： | Texas Instruments |
|---|---|
| Product Category： | Processors - Application Specialized |
| RoHS： | Yes |
| Brand： | Texas Instruments |
| Type： | Communications, Telecom, Consumer Electronics, Industrial, Medical |
| Core： | ARM Cortex A8, TMS320C64x DSP |
| Data Bus Width： | 32 bit |
| Maximum Clock Frequency： | 720 MHz |
| Operating Supply Voltage： | 0.985 V to 1.35 V |
| Maximum Operating Temperature： | + 70 C |
| Mounting Style： | SMD/SMT |
| Package / Case： | FCBGA-515 PoP |
| Instruction Type： | Fixed/Floating Point |
| Interface Type： | I2C, SPI, UART, USB |
| Memory Type： | L1/L2 Cache, ROM, SRAM |
| Minimum Operating Temperature： | 0 C |
| Processor Series： | DSP+ARM Cortex A8 |
| Series： | OMAP3525 |
| Factory Pack Quantity： | 168 |
| Tradename： | OMAP Application Processor |
OMAP3525ECBB相关文档
- Evaluation Kits: Zoom OMAP35x Medical Development Kit
- Evaluation Kits: OMAP35x Evaluation Module (EVM)
- Evaluation Kits: XDS560 High Performance Debug Probe
OMAP3525ECBB应用笔记
- OMAP35x to AM37x Hardware Migration Guide
- PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B)
- OMAP35x to AM35x Hardware Migration Guide
- Introduction to TMS320C6000 DSP Optimization
- PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I
- Powering OMAP?3 With TPS65023: Design-In Guide (Rev. B)
- OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
- OMAP35x Linux PSP Data Sheet
- PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)
- PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II
- OMAP3530/25/15/03 CBB, CBC & CUS Reflow Profiles
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