 |
ON Semiconductor 
Datasheet下载地址
| 本地下载 >> 厂商下载2 >> 第三方平台下载 >> |
MC10H136FNR2G的详细信息
| Manufacturer： | ON Semiconductor |
|---|---|
| Product Category： | Counter Shift Registers |
| RoHS： | Yes |
| Brand： | ON Semiconductor |
| Counter Type： | Hexadecimal |
| Counting Sequence： | Up/Down |
| Number of Circuits： | 1 |
| Package / Case： | PLCC-20 |
| Logic Family： | ECL |
| Logic Type： | ECL |
| Number of Input Lines： | 4 |
| Propagation Delay Time： | 2.4 ns |
| Maximum Operating Temperature： | + 75 C |
| Minimum Operating Temperature： | 0 C |
| Packaging： | Reel |
| Function： | Counter |
| Mounting Style： | SMD/SMT |
| Number of Output Lines： | 4 |
| Series： | MC10H136 |
| Factory Pack Quantity： | 500 |
| Supply Voltage - Max： | 5.46 V |
MC10H136FNR2G相关文档
- Package Drawing: Ceramic DIP 16-Lead
- Simulation Model: IBIS Model for MC10H136P
- Application Note: Interfacing Between LVDS and ECL
- Application Note: Termination of ECL Logic Devices
- Application Note: AC Characteristics of ECL Devices
- Application Note: ECL Clock Distribution Techniques
- Application Note: The ECL Translator Guide
- Simulation Model: IBIS Model for MC10H136L
- Package Drawing: PDIP-16
- Package Drawing: 20 LEAD PLLC
- Application Note: Designing with PECL (ECL at +5.0 V)
- Application Note: ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide
- Application Note: Interfacing with ECLinPS™
- Application Note: Clock Generation and Clock and Data Marking and Ordering Information Guide
- Application Note: Thermal Analysis and Reliability of WIRE BONDED ECL
- Application Note: Phase Lock Loop General Operations
- Application Note: Using Wire-OR Ties in ECLInPS Designs
- Application Note: Clock Management Design Using Low Skew and Low Jitter Devices
- Application Note: Storage and Handling of Drypack Surface Mount Device
- Application Note: Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks
- Application Note: Family Characteristics for MECL 10H™ and MECL 10K™
扫码手机查看更方便
同类器件
