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MC100LVEL32DG的详细信息
Manufacturer: | ON Semiconductor |
---|---|
Product Category: | Clock Drivers & Distribution |
RoHS: | Yes |
Brand: | ON Semiconductor |
Output Type: | ECL |
Max Output Freq: | 2.8 GHz |
Supply Voltage - Max: | +/- 3.8 V |
Supply Voltage - Min: | +/- 3 V |
Maximum Operating Temperature: | + 85 C |
Package / Case: | SOIC-8 |
Packaging: | Tube |
Input Type: | LVECL, LVPECL |
Minimum Operating Temperature: | - 40 C |
Mounting Style: | SMD/SMT |
Series: | MC100LVEL32 |
Factory Pack Quantity: | 98 |
Supply Current: | 31 mA |
Type: | ECL |
Part # Aliases: | MC100LVEL31DTG |
MC100LVEL32DG相关文档
- Application Note: Clock Management Design Using Low Skew and Low Jitter Devices
- Application Note: Storage and Handling of Drypack Surface Mount Device
- Package Drawing: DFN8 2.0x2.0x0.9mm, 0.5p
- Application Note: Clock Generation and Clock and Data Marking and Ordering Information Guide
- Simulation Model: Low Voltage ECLinPS SPICE Modeling Kit
- Package Drawing: TSSOP 8 3.0x3.0x0.95 mm
- Application Note: Interfacing Between LVDS and ECL
- Application Note: Designing with PECL (ECL at +5.0 V)
- Application Note: Termination of ECL Logic Devices
- Application Note: ECL Clock Distribution Techniques
- Application Note: Interfacing with ECLinPS™
- Application Note: ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide
- Application Note: AC Characteristics of ECL Devices
- Application Note: Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks
- Simulation Model: IBS Model for MC100LVEL32D 3.3 VCC
- Application Note: Thermal Analysis and Reliability of WIRE BONDED ECL
- Application Note: Using Wire-OR Ties in ECLInPS Designs
- Application Note: Phase Lock Loop General Operations
- Application Note: The ECL Translator Guide
- Package Drawing: SOIC-8 Narrow Body
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