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MC100EP809MNG的详细信息
Manufacturer: | ON Semiconductor |
---|---|
Product Category: | Clock Drivers & Distribution |
RoHS: | Yes |
Multiply / Divide Factor: | 1 |
Output Type: | LVCMOS, LVTTL |
Max Output Freq: | 750 MHz |
Supply Voltage - Max: | 3.6 V |
Supply Voltage - Min: | 3 V |
Maximum Operating Temperature: | + 85 C |
Package / Case: | QFN-32 |
Packaging: | Tube |
Brand: | ON Semiconductor |
Input Type: | LVCMOS, LVPECL |
Minimum Operating Temperature: | 0 C |
Mounting Style: | SMD/SMT |
Series: | MC100EP809 |
Factory Pack Quantity: | 74 |
Supply Current: | 95 mA |
Type: | ECL, HSTL, LVDS, PECL |
Part # Aliases: | MC100EP809FAG |
MC100EP809MNG相关文档
- Application Note: Interfacing Between LVDS and ECL
- Application Note: ECL Clock Distribution Techniques
- Package Drawing: QFN32, 5x5, 0.5P, 3.1x3.1EP
- Application Note: Termination of ECL Logic Devices
- Application Note: Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks
- Application Note: Clock Generation and Clock and Data Marking and Ordering Information Guide
- Application Note: Storage and Handling of Drypack Surface Mount Device
- Simulation Model: IBIS Model for mc100ep809fa
- Package Drawing: 32 LEAD LQFP 7x7, 0.8P
- Application Note: ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide
- Application Note: The ECL Translator Guide
- Application Note: Designing with PECL (ECL at +5.0 V)
- Application Note: Phase Lock Loop General Operations
- Application Note: Interfacing with ECLinPS™
- Application Note: Thermal Analysis and Reliability of WIRE BONDED ECL
- Application Note: AC Characteristics of ECL Devices
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