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MC100EL35MNR4G的详细信息
Manufacturer: | ON Semiconductor |
---|---|
Product Category: | Flip Flops |
RoHS: | Yes |
Brand: | ON Semiconductor |
Packaging: | Reel |
Series: | MC100EL35 |
Factory Pack Quantity: | 1000 |
MC100EL35MNR4G相关文档
- Package Drawing: TSSOP 8 3.0x3.0x0.95 mm
- Application Note: ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide
- Application Note: Thermal Analysis and Reliability of WIRE BONDED ECL
- Application Note: Interfacing Between LVDS and ECL
- Application Note: Clock Management Design Using Low Skew and Low Jitter Devices
- Application Note: Metastability and the ECLinPS Family
- Application Note: Using Wire-OR Ties in ECLInPS Designs
- Package Drawing: DFN8 2.0x2.0x0.9mm, 0.5p
- Application Note: Storage and Handling of Drypack Surface Mount Device
- Application Note: ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit
- Application Note: ECL Clock Distribution Techniques
- Application Note: Termination of ECL Logic Devices
- Simulation Model: IBIS Model for MC100EL35D
- Application Note: Phase Lock Loop General Operations
- Application Note: Interfacing with ECLinPS™
- Package Drawing: SOIC-8 Narrow Body
- Application Note: Clock Generation and Clock and Data Marking and Ordering Information Guide
- Application Note: Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks
- Application Note: AC Characteristics of ECL Devices
- Application Note: Designing with PECL (ECL at +5.0 V)
- Application Note: The ECL Translator Guide
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