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MC100EL11DR2G的详细信息
Manufacturer: | ON Semiconductor |
---|---|
Product Category: | Clock Buffer |
RoHS: | Yes |
Brand: | ON Semiconductor |
Number of Outputs: | 4 |
Max Input Freq: | 1500 MHz |
Propagation Delay - Max: | 0.34 ns |
Supply Voltage - Max: | +/- 5.7 V |
Supply Voltage - Min: | +/- 4.2 V |
Maximum Operating Temperature: | + 85 C |
Minimum Operating Temperature: | - 40 C |
Package / Case: | SOIC-8 Narrow |
Packaging: | Reel |
Mounting Style: | SMD/SMT |
Series: | MC100EL11 |
Factory Pack Quantity: | 2500 |
Part # Aliases: | MC100EL11DG |
MC100EL11DR2G相关文档
- Application Note: ECLinPS, ECLinPS Lite, ECLinPS Plus and GigaComm Marking and Ordering Information Guide
- Application Note: Odd Number Divide By Counters with 50% Outputs and Synchronous Clocks
- Application Note: Interfacing with ECLinPS™
- Application Note: Clock Management Design Using Low Skew and Low Jitter Devices
- Package Drawing: SOIC-8 Narrow Body
- Application Note: Interfacing Between LVDS and ECL
- Application Note: Termination of ECL Logic Devices
- Application Note: Clock Generation and Clock and Data Marking and Ordering Information Guide
- Application Note: Storage and Handling of Drypack Surface Mount Device
- Application Note: ECLinPS and ECLinPS Lite SPICE I/O Modeling Kit
- Simulation Model: IBIS Model for mc100el11d -5.0V
- Package Drawing: TSSOP 8 3.0x3.0x0.95 mm
- Simulation Model: IBIS Model for MC100EP11DT -3.3V
- Simulation Model: IBIS Model for MC100EL11D -5.2VEE
- Simulation Model: IBIS Model for mc100el11d 5.0V
- Application Note: The ECL Translator Guide
- Application Note: Thermal Analysis and Reliability of WIRE BONDED ECL
- Application Note: AC Characteristics of ECL Devices
- Application Note: Designing with PECL (ECL at +5.0 V)
- Application Note: ECL Clock Distribution Techniques
- Application Note: Using Wire-OR Ties in ECLInPS Designs
- Simulation Model: IBS Model for MC100EL11D 5.0V
- Application Note: Phase Lock Loop General Operations
- Application Note: Metastability and the ECLinPS Family
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