首页 > Bergquist > 热量管理 > 热 - 垫,片 > HF115AC-0.0055-AC-05
Image HF115AC-0.0055-AC-05
型号:

HF115AC-0.0055-AC-05

厂商: Bergquist
标准:
分类: 热量管理热 - 垫,片
描述: therm pad TO-3 W/adh HI-flow
报错 收藏

Datasheet下载地址

本地下载 >> 厂商下载 >>

HF115AC-0.0055-AC-05的详细信息

Datasheets:
Hi-Flow 115-AC:
Product Photos:
HF115AC-0.0055-AC-05:
RoHS Information:
Hi-Flow 115-AC Material Report:
Catalog Drawings:
TO-3_05:
Standard Package : 100
Category: Fans, Thermal Management
Family: Thermal - Pads, Sheets
Series: Hi-Flow® 115-AC
Usage: TO-3
Shape: Rhombus
Outline: 41.91mm x 28.95mm
Thickness: 0.0055" (0.140mm)
Material: Phase Change Compound
Adhesive: Adhesive - One Side
Backing, Carrier: Fiberglass
Color: Gray
Thermal Resistivity: 0.35°C/W
Thermal Conductivity: 0.8 W/m-K
Dynamic Catalog: Hi-Flow® 115-AC Series
Other Names: BER166HF115AC-05HF115AC00055AC05HF115TAAC-05