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| 型号： | BLF6G38-50,112 |
| 厂商： |
 NXP Semiconductors |
| 标准： |   |
| 分类： | 半导体 ， 分离式半导体 |
| 描述： | transistors RF mosfet ldmos tns |
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Datasheet下载地址
| 本地下载 >> 厂商下载2 >> 第三方平台下载 >> |
BLF6G38-50,112的详细信息
| Manufacturer： | NXP |
|---|---|
| Product Category： | Transistors RF MOSFET |
| RoHS： | Yes |
| Brand： | NXP Semiconductors |
| Configuration： | Single |
| Transistor Polarity： | N-Channel |
| Vds - Drain-Source Breakdown Voltage： | 65 V |
| Id - Continuous Drain Current： | 16.5 A |
| Vgs - Gate-Source Breakdown Voltage： | 13 V |
| Maximum Operating Temperature： | + 150 C |
| Mounting Style： | SMD/SMT |
| Package / Case： | SOT502B |
| Packaging： | Tube |
| Minimum Operating Temperature： | - 65 C |
| Product Type： | MOSFET Power |
| Rds On - Drain-Source Resistance： | 290 mOhms |
| Factory Pack Quantity： | 20 |
| Part # Aliases： | BLF6G38-50 |
BLF6G38-50,112相关文档
- Simulation model: RF Power Simulation Example for MicroWave Office (v.1.0)
- Selection guide: NXP's RF Manual 16th edition (v.1.0)
- Simulation model: RF Power Model Library for MicroWave Office (v.2.2)
- Application note: Mounting and Soldering of RF transistors (v.1.0)
- Brochure: Your partner in Mobile Communication Infrastructure design; High Performance RF for wireless infrastructure (v.1.0)
- Simulation model: RF Power Model Library Manual and Installation Instructions for MicroWave Office (v.3.2)
- Simulation model: BLF6G38-50 ADS Model (v.1.0)
- Mounting and soldering: Fatigue in aluminum bond wires (v.1.0)
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