型号:

BDN13-3CB/A01

厂商: CTS Thermal Management Products
标准:
分类: 热量管理热敏 - 散热器
描述: heatsink cpu W/adhesive 1.31"SQ
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BDN13-3CB/A01的详细信息

Datasheets:
Various Semiconductor Heat Sink:
Product Photos:
BDN13-3CB/A01 Heat Sink:
RoHS Information:
BDN Series RoHS Cert:
Catalog Drawings:
BDN13-3CB^A01:
Standard Package : 1
Category: Fans, Thermal Management
Family: Thermal - Heat Sinks
Series: BDN
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.310" (33.27mm)
Width: 1.310" (33.27mm)
Diameter: -
Height Off Base (Height of Fin): 0.355" (9.02mm)
Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM
Thermal Resistance @ Natural: 16.1°C/W
Material: Aluminum
Material Finish: Black Anodized
Dynamic Catalog: BDN Series
Other Names: 294-1100BDN133CB/A01