型号:

BBL-125-T-F

厂商: Samtec Inc
标准:
分类: 连接器矩形 - 板对板连接器 - 针座,公引脚
描述: conn headr lopro 25pos .100 tin
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BBL-125-T-F的详细信息

Datasheets:
BBx, BDL, BHS Series Drawing:
BBx, BDL, BHS Series Spec Sheet:
BBL Through Hole Footprint:
Product Training Modules:
Board-to-Board Connectors:
Catalog Drawings:
BBL-xxx-G-F Series:
Featured Product:
Board-To-Board Interconnect Systems:
Standard Package : 1
Category: Connectors, Interconnects
Family: Rectangular - Board to Board Connectors - Headers, Male Pins
Series: BBL
Packaging : Bulk
Connector Type: Unshrouded
Number of Positions: 25
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Height Stacking (Mating): -
Molding Height Above Board: 0.085" (2.16mm)
Contact Mating Length: 0.122" (3.10mm)
Mounting Type: Through Hole
Termination: Solder
Contact Finish: Tin
Contact Finish Thickness: -
Features: -
Color: Black
Mating Products: SAM1110-25-ND - CONN RCPT .100" 25POS TIN PCBSAM1109-25-ND - CONN RCPT .100" 25POS TIN PCBSAM1108-25-ND - CONN RCPT .100" 25POS TIN PCBSAM1107-25-ND - CONN RCPT .100" 25POS GOLD PCBSAM1106-25-ND - CONN RCPT .100" 25POS GOLD PCBSAM1105-25-ND - CONN RCPT .100" 25POS GOLD PCBSAM1104-25-ND - CONN RCPT .100" 25POS GOLD PCBSAM1103-25-ND - CONN RCPT .100" 25POS GOLD PCBSAM1102-25-ND - CONN RCPT .100" 25POS GOLD PCB
Other Names: SAM1003-25