型号:

BBL-111-T-F

厂商: Samtec Inc
标准:
分类: 连接器矩形 - 板对板连接器 - 针座,公引脚
描述: conn headr lopro 11pos .100 tin
报错 收藏

Datasheet下载地址

本地下载 >> 厂商下载 >>

BBL-111-T-F的详细信息

Datasheets:
BBx, BDL, BHS Series Drawing:
BBx, BDL, BHS Series Spec Sheet:
BBL Through Hole Footprint:
Product Training Modules:
Board-to-Board Connectors:
Catalog Drawings:
BBL-xxx-G-F Series:
Featured Product:
Board-To-Board Interconnect Systems:
Standard Package : 1
Category: Connectors, Interconnects
Family: Rectangular - Board to Board Connectors - Headers, Male Pins
Series: BBL
Packaging : Bulk
Connector Type: Unshrouded
Number of Positions: 11
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Height Stacking (Mating): -
Molding Height Above Board: 0.085" (2.16mm)
Contact Mating Length: 0.122" (3.10mm)
Mounting Type: Through Hole
Termination: Solder
Contact Finish: Tin
Contact Finish Thickness: -
Features: -
Color: Black
Mating Products: SAM1110-11-ND - CONN RCPT .100" 11POS TIN PCBSAM1109-11-ND - CONN RCPT .100" 11POS TIN PCBSAM1108-11-ND - CONN RCPT .100" 11POS TIN PCBSAM1107-11-ND - CONN RCPT .100" 11POS GOLD PCBSAM1106-11-ND - CONN RCPT .100" 11POS GOLD PCBSAM1105-11-ND - CONN RCPT .100" 11POS GOLD PCBSAM1104-11-ND - CONN RCPT .100" 11POS GOLD PCBSAM1103-11-ND - CONN RCPT .100" 11POS GOLD PCBSAM1102-11-ND - CONN RCPT .100" 11POS GOLD PCB
Other Names: SAM1003-11