型号:

BBL-103-G-E

厂商: Samtec Inc
标准:
分类: 连接器矩形 - 板对板连接器 - 针座,公引脚
描述: conn header lopro 3pos .100 gold
报错 收藏

Datasheet下载地址

本地下载 >> 厂商下载 >>

BBL-103-G-E的详细信息

Datasheets:
BBx, BDL, BHS Series Drawing:
BBx, BDL, BHS Series Spec Sheet:
BBL Through Hole Footprint:
Catalog Drawings:
BBL-xxx-G-E Series:
Featured Product:
Board-To-Board Interconnect Systems:
Standard Package : 1
Category: Connectors, Interconnects
Family: Rectangular - Board to Board Connectors - Headers, Male Pins
Series: BBL
Packaging : Bulk
Connector Type: Unshrouded
Number of Positions: 3
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Height Stacking (Mating): -
Molding Height Above Board: 0.070" (1.78mm)
Contact Mating Length: 0.105" (2.67mm)
Mounting Type: Through Hole
Termination: Solder
Contact Finish: Gold
Contact Finish Thickness: 20µin (0.51µm)
Features: -
Color: Black
Dynamic Catalog: BBL Series
Mating Products: SAM1110-03-ND - CONN RCPT .100" 3POS TIN PCBSAM1109-03-ND - CONN RCPT .100" 3POS TIN PCBSAM1108-03-ND - CONN RCPT .100" 3POS TIN PCBSAM1107-03-ND - CONN RCPT .100" 3POS GOLD PCBSAM1106-03-ND - CONN RCPT .100" 3POS GOLD PCBSAM1105-03-ND - CONN RCPT .100" 3POS GOLD PCBSAM1104-03-ND - CONN RCPT .100" 3POS GOLD PCBSAM1103-03-ND - CONN RCPT .100" 3POS GOLD PCBSAM1102-03-ND - CONN RCPT .100" 3POS GOLD PCB
Other Names: SAM1000-03