 |
Texas Instruments 
Datasheet下载地址
| 本地下载 >> 厂商下载2 >> 第三方平台下载 >> |
AM3715CUS的详细信息
| Manufacturer： | Texas Instruments |
|---|---|
| Product Category： | Microprocessors - MPU |
| RoHS： | Yes |
| Brand： | Texas Instruments |
| Series： | AM3715 |
| Core： | ARM Cortex A8 |
| Data Bus Width： | 16 bit |
| Maximum Clock Frequency： | 800 MHz |
| L1 Cache Instruction / Data Memory： | 32 kB, 32 kB |
| Operating Supply Voltage： | 1.71 V to 1.91 V |
| Maximum Operating Temperature： | + 90 C |
| Mounting Style： | SMD/SMT |
| Package / Case： | FC/CSP-423 |
| Data RAM Size： | 64 kB |
| Data ROM Size： | 32 kB |
| I/O Voltage： | 1.8 V, 3 V |
| L2 Cache Instruction / Data Memory： | 256 kB |
| Minimum Operating Temperature： | 0 C |
| Number of Programmable I/Os： | 188 |
| Processor Series： | Sitara ARM Cortex A8 and ARM9 |
| Factory Pack Quantity： | 90 |
| Tradename： | Sitara ARM Cortex |
AM3715CUS相关文档
- Evaluation Kits: AM/DM37x Evaluation Module
- Evaluation Kits: Electronic Point of Sale/Service Reference Design
- Evaluation Kits: XDS200 Price/Performance-balanced Debug Probe
- Evaluation Kits: XDS560 High Performance Debug Probe
- Evaluation Kits: BeagleBoard-xM Development Board
- Function Diagram: fbd_sprs616f
AM3715CUS应用笔记
- PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B)
- Setting up AM37x SDRC Registers
- PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I
- AM3715/03 Memory Subsystem
- PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
- AM3715 GPMC
- Ethernet Connectivity via GPMC
- OMAP35x to AM37x Hardware Migration Guide
- AM37x/DM37x Schematic Checklist
- AM37x CUS Routing Guidelines
- PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II
- AM37x EVM Software Developer's Guide
- AM/DM37x Overview
- PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)
- AM/DM37x Power Estimation Spreadsheet
- AM3715/03 SDRC Subsystem
扫码手机查看更方便
同类器件
