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Texas Instruments 
Datasheet下载地址
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AM3703CBCD100的详细信息
| Manufacturer： | Texas Instruments |
|---|---|
| Product Category： | Microprocessors - MPU |
| RoHS： | Yes |
| Brand： | Texas Instruments |
| Series： | AM3703 |
| Core： | ARM Cortex A8 |
| Data Bus Width： | 16 bit |
| L1 Cache Instruction / Data Memory： | 32 kB, 32 kB |
| Operating Supply Voltage： | 1.71 V to 1.91 V |
| Maximum Operating Temperature： | + 90 C |
| Mounting Style： | SMD/SMT |
| Package / Case： | FCBGA-515 PoP |
| Data RAM Size： | 64 kB |
| Data ROM Size： | 32 kB |
| Development Kit： | TMDXEVM3715 |
| I/O Voltage： | 1.8 V |
| L2 Cache Instruction / Data Memory： | 256 kB |
| Minimum Operating Temperature： | - 40 C |
| Number of Timers： | 16 |
| Processor Series： | Sitara ARM Cortex A8 and ARM9 |
| Factory Pack Quantity： | 119 |
| Tradename： | Sitara ARM Cortex |
AM3703CBCD100相关文档
- Evaluation Kits: XDS560 High Performance Debug Probe
- Evaluation Kits: AM/DM37x Evaluation Module
- Evaluation Kits: BeagleBoard-xM Development Board
- Evaluation Kits: XDS200 Price/Performance-balanced Debug Probe
- Function Diagram: fbd_sprs616f
AM3703CBCD100应用笔记
- PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)
- AM/DM37x Overview
- AM37x EVM Software Developer's Guide
- AM3715/03 SDRC Subsystem
- AM/DM37x Power Estimation Spreadsheet
- PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I
- Setting up AM37x SDRC Registers
- PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
- AM3715/03 Memory Subsystem
- Ethernet Connectivity via GPMC
- AM37x/DM37x Schematic Checklist
- OMAP35x to AM37x Hardware Migration Guide
- PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I (Rev. B)
- PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II
- AM37x CUS Routing Guidelines
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