Molex 
1051420133的详细信息
| Datasheets： | |
|---|---|
| 105142013x Drawing： | |
| Standard Package ： | 200 |
| Category： | Connectors, Interconnects |
| Family： | Sockets for ICs, Transistors |
| Series： | 105142 |
| Packaging ： | Tray |
| Type： | LGA |
| Number of Positions or Pins (Grid)： | 2011 (47 x 58) |
| Pitch - Mating： | 0.040" (1.01mm) |
| Contact Finish - Mating： | Gold |
| Contact Finish Thickness - Mating： | 30µin (0.76µm) |
| Contact Material - Mating： | Copper Alloy |
| Mounting Type： | Surface Mount |
| Features： | Open Frame |
| Termination： | Solder |
| Pitch - Post： | 0.040" (1.01mm) |
| Contact Finish - Post： | - |
| Contact Finish Thickness - Post： | - |
| Contact Material - Post： | - |
| Housing Material： | Thermoplastic |
| Operating Temperature： | - |
| Termination Post Length： | - |
| Material Flammability Rating： | UL94 V-0 |
| Current Rating： | - |
| Contact Resistance： | - |
| Associated Product： | WM9336-ND - LGA 2011-0 BACK PLATE ASSEMBLYWM9335-ND - NARROW ILM ASSEMLY W/ ILM COVERWM9334-ND - STANDARD ILM ASSY WITH COVER |
| Other Names： | 105142-0133 |
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